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1

[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Mechanical vs. Electrical Properties of Conductive Adhesive Bonds as Function of Operating Temperature

Branzei, Mihai, Svasta, Paul Mugur, Vladescu, Marian, Plotog, Ioan, Mihailescu, Bogdan, Varzaru, Gaudentiu

Année:

2019

Langue:

english

Fichier:

PDF, 1.28 MB

english, 2019

2

[IEEE 2010 3rd International Symposium on Electrical and Electronics Engineering (ISEEE) - Galati, Romania (2010.09.16-2010.09.18)] 2010 3rd International Symposium on Electrical and Electronics Engineering (ISEEE) - VPS technology and applications

Plotog, Ioan, Varzaru, Gaudentiu, Svasta, Paul

Année:

2010

Langue:

english

Fichier:

PDF, 594 KB

english, 2010

3

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Comparison between two Surface Insulation Resistance tests regarding different soldering techniques

Pantazica, Mihaela, Marghescu, Cristina, Svasta, Paul, Varzaru, Gaudentiu, Plotog, Ioan, Tamas, Cosmin Andrei

Année:

2012

Langue:

english

Fichier:

PDF, 956 KB

english, 2012

4

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - Solder joints properties as function of multiple reflow Vapor Phase Soldering process

Branzei, Mihai, Plotog, Ioan, Miculescu, Florin, Varzaru, Gaudentiu, Svasta, Paul, Thumm, Andreas

Année:

2012

Langue:

english

Fichier:

PDF, 374 KB

english, 2012

5

[IEEE 2015 7th International Conference on Electronics, Computers and Artificial Intelligence (ECAI) - Bucharest, Romania (2015.6.25-2015.6.27)] 2015 7th International Conference on Electronics, Computers and Artificial Intelligence (ECAI) - Small farm complex irrigation controller based on wireless communication

Plotog, Ioan, Varzaru, Gaudentiu, Mihailescu, Bogdan, Iacomi, Beatrice, Madjar, Roxana, Iacomi, Cristian, Popescu, Viorel, Sfetcu, Catalin

Année:

2015

Langue:

english

Fichier:

PDF, 254 KB

english, 2015

6

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Investigation on the efficiency of thermal relief shapes on different Printed Circuit Boards

Plotog, Ioan, Varzaru, Gaudentiu, Bunea, Radu, Busu, Iulian, Cucu, Traian, Svasta, Paul

Année:

2010

Langue:

english

Fichier:

PDF, 1.52 MB

english, 2010

7

SPIE Proceedings [SPIE Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies - Constanta, Romania (Thursday 26 August 2010)] Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies V - Rain sensor for automatic systems on vehicles

Vasile, Alexandru, Vasile, Irina, Nistor, Adrian, Vladareanu, Luige, Pantazica, Mihaela, Caldararu, Florin, Bonea, Andreea, Drumea, Andrei, Plotog, Ioan, Schiopu, Paul, Caruntu, George

Année:

2010

Langue:

english

Fichier:

PDF, 448 KB

english, 2010

8

[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Working temperatures influence over the solder joints properties

Plotog, Ioan, Vladescu, Marian

Année:

2014

Langue:

english

Fichier:

PDF, 282 KB

english, 2014

9

[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - The mischmetal and Bi94Zn6 effect alloying on SACX 0307

Branzei, Mihai, Pencea, Ion, Plotog, Ioan, Miculescu, Florin, Cristea, Ionut, Thumm, Andreas

Année:

2013

Langue:

english

Fichier:

PDF, 1009 KB

english, 2013

10

[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - 4 P soldering model for solder joints quality assessment

Svasta, Paul, Plotog, Ioan, Cucu, Traian, Vasile, Alexandru, Marin, Alexandru

Année:

2009

Langue:

english

Fichier:

PDF, 2.37 MB

english, 2009

11

[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - Multiconvolutional approach for uncertainty estimation of the thermal diffusivity measured by flash method

Pencea, Ion, Plotog, Ioan, Branzei, Mihai, Bibis, Adrian, Svasta, Paul

Année:

2013

Langue:

english

Fichier:

PDF, 302 KB

english, 2013

12

[IEEE 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Timisoara, Romania (2011.10.20-2011.10.23)] 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Solder joints properties assessment in the terms of 4P Soldering Model

Plotog, Ioan, Cucu, Traian, Mihailescu, Bogdan, Svasta, Paul, Branzei, Mihai, Tarcolea, Mihai, Miculescu, Florin, Thumm, Andreas, Flechtmann, Andreas

Année:

2011

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2011

13

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Mechanical test for vapor phase solder joint

Dumitru, Georgiana, Tudor, Andrei, Cananau, Sorin, Plotog, Ioan, Varzaru, Gaudentiu

Année:

2012

Langue:

english

Fichier:

PDF, 749 KB

english, 2012

14

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - PCBs thermophysical properties in lead-free assembling process assessment

Plotog, Ioan, Branzei, Mihai, Svasta, Paul, Miculescu, Marian, Cucu, Traian, Thumm, A.

Année:

2010

Langue:

english

Fichier:

PDF, 314 KB

english, 2010

15

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Low silver, lead free solder paste, new alloy developments

Cucu, Traian C., Plotog, Ioan, Svasta, Paul, Branzei, Mihai

Année:

2010

Langue:

english

Fichier:

PDF, 235 KB

english, 2010

16

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - Surface insulation resistance testing of solder pastes with protective coating

Pantazica, Mihaela, Marghescu, Cristina, Tamas, Cosmin, Svasta, Paul, Plotog, Ioan, Varzaru, Gaudentiu

Année:

2012

Langue:

english

Fichier:

PDF, 741 KB

english, 2012

17

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Methods for pads thermophysical parameters assessment in terms of 4P Soldering Model

Plotog, Ioan, Mihailescu, Bogdan, Pencea, Ioan, Branzei, Mihai, Svasta, Paul, Cucu, Traian, Tarcolea, Mihai

Année:

2011

Langue:

english

Fichier:

PDF, 769 KB

english, 2011

18

[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Promoting the entrepreneurial spirit within the Romanian electronics industry

Fuica, Rosemari, Schiopu, Paul, Plotog, Ioan

Année:

2009

Langue:

english

Fichier:

PDF, 1.84 MB

english, 2009

19

[IEEE 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Galati, Romania (2013.10.24-2013.10.27)] 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Lead/Lead Free solder joints comparative shear tests function of working temperature and soldering thermal profile

Plotog, Ioan, Varzaru, Gaudentiu, Mihailescu, Bogdan, Branzei, Mihai, Bibis, Adrian, Cristea, Ionut

Année:

2013

Langue:

english

Fichier:

PDF, 629 KB

english, 2013

20

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - EM simulation and experimental assessment of VPS process control module

Mihailescu, Bogdan, Plotog, Ioan, Svasta, Paul, Vladescu, M.

Année:

2010

Langue:

english

Fichier:

PDF, 273 KB

english, 2010

21

[IEEE 2008 31st International Spring Seminar on Electronics Technology (ISSE) - Budapest, Hungary (2008.05.7-2008.05.11)] 2008 31st International Spring Seminar on Electronics Technology - Investigations on assembling of electronic packages onto glass substrates using lead-free technology

Plotog, Ioan, Codreanu, Norocel, Svasta, Paul, Cucu, Traian, Turcu, Carmen, Varzaru, Gaudentiu, Lazar, Gheorghe, Batuca, Alexandru

Année:

2008

Langue:

english

Fichier:

PDF, 1.03 MB

english, 2008

22

[IEEE 2010 3rd International Symposium on Electrical and Electronics Engineering (ISEEE) - Galati, Romania (2010.09.16-2010.09.18)] 2010 3rd International Symposium on Electrical and Electronics Engineering (ISEEE) - Mechanical test assessment for electronic modules able to function in harsh conditions

Plotog, Ioan, Varzaru, Gaudentiu, Svasta, Paul

Année:

2010

Langue:

english

Fichier:

PDF, 428 KB

english, 2010

23

Dental Plating Efficiency of Metal Base Dental Alloys by Thermal Diffusivity Study

Miculescu, Marian, Bane, Marin, Miculescu, Florin, Preda, Oana, Plotog, Ioan

Journal:

Key Engineering Materials

Année:

2015

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2015

24

Mechanical Characteristics of Electronic Printed Circuit Obtained by the Vapour Phase Soldering Process

Dumitru, Georgiana Ionela, Tudor, Andrei, Chisiu, Georgiana, Plotog, Ioan

Journal:

Applied Mechanics and Materials

Année:

2014

Langue:

english

Fichier:

PDF, 524 KB

english, 2014

25

SPIE Proceedings [SPIE Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies 2014 - Constanta, Romania (Thursday 21 August 2014)] Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VII - Power LED efficiency in relation to operating temperature

Cristea, Ionica, Vladescu, Marian, Tamas, Razvan, Plotog, Ioan, Vladescu, Marian

Année:

2015

Langue:

english

Fichier:

PDF, 262 KB

english, 2015

26

SPIE Proceedings [SPIE Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies 2014 - Constanta, Romania (Thursday 21 August 2014)] Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VII - Investigations on electroluminescent tapes and foils in relation to their applications in automotive

Cristea, Ionica, Vladescu, Marian, Tamas, Razvan, Plotog, Ioan

Année:

2015

Langue:

english

Fichier:

PDF, 310 KB

english, 2015

27

Investigation on the Use of Photovoltaic Cells Based Devices for Pace of Growth Forecasts and Estimates of Crop Production

Plotog, Ioan, Varzaru, Gaudentiu, Rosca, Ioan, Iacomi, Cristian, Iacomi, Beatrice, Madjar, Roxana

Journal:

Agriculture and Agricultural Science Procedia

Année:

2015

Langue:

english

Fichier:

PDF, 5.27 MB

english, 2015

28

[IEEE 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Bucharest, Romania (2014.10.23-2014.10.26)] 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Device for multiple environment parameters measurements for agriculture use

Plotog, Ioan, Varzaru, Gaudentiu, Mihailescu, Bogdan

Année:

2014

Langue:

english

Fichier:

PDF, 305 KB

english, 2014

29

SPIE Proceedings [SPIE Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies 2012 - Constanta, Romania (Thursday 23 August 2012)] Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VI - Interconnection of germanium photovoltaic cells using vapor phase soldering technology

Plotog, Ioan, Vladescu, Marian, Schiopu, Paul, Tamas, Razvan

Année:

2012

Langue:

english

Fichier:

PDF, 457 KB

english, 2012

30

SPIE Proceedings [SPIE Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies 2016 - Constanta, Romania (Thursday 25 August 2016)] Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VIII - Comparative shear tests of some low temperature lead-free solder pastes

Vladescu, Marian, Tamas, Razvan, Cristea, Ionica, Branzei, Mihai, Plotog, Ioan, Varzaru, Gaudentiu, Cucu, Traian C.

Année:

2016

Langue:

english

Fichier:

PDF, 885 KB

english, 2016

31

Thermophysical Properties in Assembling Process at Macro and Micro Level

Branzei, Mihai, Plotog, Ioan

Journal:

Advanced Materials Research

Année:

2015

Langue:

english

Fichier:

PDF, 1007 KB

english, 2015

32

[IEEE 2017 9th International Conference on Electronics, Computers and Artificial Intelligence (ECAI) - Targoviste (2017.6.29-2017.7.1)] 2017 9th International Conference on Electronics, Computers and Artificial Intelligence (ECAI) - Remote control of sensor-less permanent magnet synchronous motor

Vasilescu, Constantin, Popescu, Viorel, Varzaru, Gaudentiu, Mihailescu, Bogdan, Plotog, Ioan

Année:

2017

Langue:

english

Fichier:

PDF, 1.27 MB

english, 2017

33

[IEEE 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Sofia, Bulgaria (2017.5.10-2017.5.14)] 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Comparative shear tests of two low melting point solder pastes relating to their thermal diffusivity

Branzei, Mihai, Vladescu, Marian, Plotog, Ioan, Cucu, Traian

Année:

2017

Langue:

english

Fichier:

PDF, 743 KB

english, 2017

34

[IEEE 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Zlatibor, Serbia (2018.5.16-2018.5.20)] 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Properties Investigations on Copper Based Printed Conductive Pastes Electrical Joints

Branzei, Mihai, Ionescu, Ciprian, Plotog, Ioan, Varzaru, Gaudentiu

Année:

2018

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2018

35

[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Mechanical vs. Electrical Properties of Conductive Adhesive Bonds as Function of Operating Temperature

Branzei, Mihai, Svasta, Paul Mugur, Vladescu, Marian, Plotog, Ioan, Mihailescu, Bogdan, Varzaru, Gaudentiu

Année:

2019

Fichier:

PDF, 1.28 MB

2019

36

[IEEE 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Cluj-Napoca, Romania (2019.10.23-2019.10.26)] 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Electrically Conductive Paste Printed Volume Influence on Bonds Properties

Branzei, Mihai, Varzaru, Gaudentiu, Vladescu, Marian, Mihailescu, Bogdan, Plotog, Ioan

Année:

2019

Fichier:

PDF, 4.45 MB

2019